Sheet Molding Compound Automotive Component Reliability Using a Micromechanical Damage Approach

Teaching Durability in Automotive Applications Using a Reliability Approach

Fatigue phenomena, which appear generally below the yield stress, is the cause of more than 80 % of in-service mechanical failures. However, the optimization of the weight and cost when designing mechanical components or structures, linked to improved performance, leads to increasingly stressed components. Therefore a fatigue design approach must be done by the engineer. This paper shows the ex...

A damage-friction interface model derived from micromechanical approach

The present paper deals with a micromechanical model of interface able to couple the damage (micro-crack) evolution, the non-penetration conditions (Signorini equations) and the friction effect (Coulomb’s law). At a typical point of the interface, a Representative Volume Element (RVE) is considered; it is characterized by the presence of two different materials and by a microcrack evolving alon...

Characterizing the Mechanical Properties of Callaways Forged Carbon Fiber Reinforced Sheet Molding Compound

Volumetrical Characterization of Sheet Molding Compounds

For a comprehensive study of Sheet Molding Compound (SMC) surfaces, topographical data obtained by chromatic confocal imaging were submitted systematically for the development of a profile model to understand the formation of cavities on the surface. In order to qualify SMC surfaces and to predict their coatability, a characterization of cavities is applied. To quantify the effect of surface mo...

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

The small outline transistor (SOT) devices which were interconnected with 20 lm copper bonding wire and encapsulated with commercial epoxy molding compound (EMC) have been used in a series of reliability tests which including the thermal shock test, the electrical service life test, and the isothermal aging test. Isolated IMC spots were found at the bonding interface during the thermal shock te...